Printed circuit boards in the CAF test: The most important questions and answers
To ensure that printed circuit boards work reliably even under high temperature fluctuations, they are intensively tested in advance. KSG explains how.
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Fascination High-Frequency Printed Circuit Boards – Part 1: Success Factors and Insights into the Production Process
In an increasingly digitalized and fast-paced world ,speed is of the essence. This applies to both everyday and industrial applications, be it wireless transmission systems, sensors or even radar applications. An important building block for these high-frequency applications are high-quality and reliable printed circuit boards. But what exactly are the success factors for high-frequency PCBs …
KSG Support Line: The team behind extension -555
When extension 555 is called at KSG, the four phones of Dirk Deiters, Thomas Doberitzsch, Johann Hackl and Uwe Meyer ring simultaneously. Whoever picks up first has the caller on the line, quickly and easily answering questions like, “Can you help me choose the right PCB base material for my new application?”, “What are the …
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Solder Surfaces for Printed Circuit Boards, Part 4: HAL lead-free
The HAL lead-free solder surface offers the best solderability of all surfaces, but the thickness of the tin layer varies.
SIR test according to IPC
With the SIR test according to IPC, we test surface resistance in a humid/heat climate. We explain how this works exactly.
Soldering surfaces for printed circuit boards, part 3: electroless tin
For the Soldering surface immersion tin (chem. Sn) or ISn (immersion Tin), a 1 to 1.3 µm thin tin layer is deposited on the copper surfaces in a wet chemical process. According to IPC-4554, this is ≥ 0.6 µm pure tin (usable tin). The tin layer forms a planar soldering surface and thus provides the …
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Solder Surfaces for Printed Circuit Boards, Part 2: Electroless Nickel-Gold
The solder surface electroless nickel-gold (chem. NiAu) is also called ENIG (Electroless Nickel Immersion Gold). In a wet chemical process, a 3 to 6 µm thin layer of nickel (phosphorus-doped) is first deposited on the copper surfaces of the component connections. The nickel layer forms a barrier for the 0.05 to 0.125 µm thin gold …
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Solder surface or printed circuit board finish, Part 1: Function and properties
The solder surface, final surface or also called PCB finish, is a thin metallic or organic layer that the PCB manufacturer applies to the copper surfaces of the component connections (solder pads). The solder surface covers the exposed copper on the PCB and preserves the solderability within the guaranteed storage period of the PCBs under …
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Tips for PCB design with copper elements (HSMtec) – Part 2
Design rules for high current conductor paths These rules must be observed when designing HSMtec printed circuit boards: Standard values for HSMtec PCBs are 0.8 to 3.2 mm final thickness; maximum 12 layers; maximum 3 layers for the copper cross-sections with copper profiles as well as currents up to 400 A Basic rule for current …
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