Iceberg® printed circuit boards are partial thick copper printed circuit boards with mixed copper thicknesses of 105 and 400 µm on the same plane in the outer layers. In the process, about two thirds of the thick copper is sunk into the base material. The “sinking” of the thick copper structures in the base material […]
Iceberg® circuit boards Mehr erfahren »
Plugging, Holefilling, Microvia Copper Filling or Via Hole Plugging refers to the filling of metallized through holes or metallized blind holes on the outer layers of the printed circuit board. There, even with highly complex circuit carriers, a planar surface topography is achieved, through which the process reliability and dependability in the assembly process, no
Incorrect handling and improper storage of printed circuit boards have fatal consequences. Contamination, moisture and electrostatic charge can irreparably damage printed circuit boards or later electronic assemblies, reduce solderability and affect the electrical test. Absorbed moisture in base materials can cause internal delamination, twisting and warping, or excessive stresses in the through-metallizations. The reason: During
Storing printed circuit boards correctly: the most important tips Mehr erfahren »
HSMtec 3D printed circuit board: the self-supporting 3D construction The HSMtec 3D printed circuit board does not require any flex foil at the bending point. This technique uses copper wires and copper profiles pressed into the FR4 material of the multilayer as bendable material. At the bending edges the FR4 is removed with notch milling.
3D printed circuit boards: three technologies, three examples (Part 3) Mehr erfahren »
Semiflex printed circuit board: the low-cost alternative to rigid-flex Semiflex is considered a cost-effective alternative to rigid-flex technology. The absence of flex foils lowers the price, but also reduces the bending properties. The moving areas are created here by deep milling in the FR4 circuit board, and the residual thickness is only approx. 150 µm.
3D printed circuit boards: three technologies, three examples (part 2) Mehr erfahren »
Three-dimensional printed circuit boards make optimum use of the limited installation space and can be constructed using various processes, assembly variants and materials. With rigid-flex, semiflex and HSMtec 3D, we present three manufacturing processes and highlight their technical properties, possible applications as well as their advantages and limitations. Increasing packing density, reducing weight
3D printed circuit boards: three technologies, three examples (part 1) Mehr erfahren »
In the HSMtec process, 500 µm thick copper elements with variable widths from 2 to 12 mm and individual lengths are placed in the inner layers of the multilayer and embedded in the printed circuit board. By partially integrating copper profiles into the PCB, high-current paths – or thermal management and fine conductor layout
The abbreviation HDI stands for High Density Interconnect and refers to multilayer printed circuit boards with four or more layers that are built up sequentially in several pressing operations (Sequential Build Up, abbreviated: SBU). With this design, high wiring and placement densities for high-pole active components can be realized on an electronic assembly.
HDI/SBU printed circuit boards Mehr erfahren »
Multifunctional system boards are already state of the art today. Different starting materials, methods and manufacturing processes enable highly specialized circuit carriers: densely packed and/or highly integrated, RF-capable, high-current-capable, heat-optimized and three-dimensional. The current technology roadmap shows what drives and controls the development of PCB technology and where the journey is headed. The development of
A look at the roadmap for the European printed circuit board industry Mehr erfahren »
