Tag: End surfaces

Solder Surfaces for Printed Circuit Boards, Part 4: HAL lead-free

In “HAL lead-free” (hot air levelling lead-free), hot air solder leveling or HASL (hot air solder leveling), a layer of liquid tin is applied to the exposed copper surfaces. The circuit boards are first sprayed with flux and then immersed in a vertical solder bath. When the PCBs are pulled out of the solder bath,

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