Organic surface protection (OSP, or organic solderability preservative) is a cost-effective alternative to metallic surface finishes for printed circuit boards. An organic layer is formed on the exposed copper areas, which protects against oxidation by oxygen. This maintains the solderability of the PCB for a defined period of time without the need for an additional
Tag: Surface finishing
The HAL lead-free solder surface offers the best solderability of all surfaces, but the thickness of the tin layer varies.
Electroless nickel-gold is the most widely used solder surface for printed circuit boards in Europe. Learn the reasons in our blog article.
The soldering surface – also known as the end surface or PCB finish – is a thin metallic or organic layer that the PCB manufacturer applies to the copper surfaces of the component connections (solder pads). As natural copper tends to oxidize in the air, soldering the components would be difficult or impossible. The soldering