The HAL lead-free solder surface offers the best solderability of all surfaces, but the thickness of the tin layer varies.
Solder Surfaces for Printed Circuit Boards, Part 4: HAL lead-free Mehr erfahren »
With the SIR test according to IPC, we test surface resistance in a humid/heat climate. We explain how this works exactly.
SIR test according to IPC Mehr erfahren »
Electroless nickel-gold is the most widely used solder surface for printed circuit boards in Europe. Learn the reasons in our blog article.
Solder Surfaces for Printed Circuit Boards, Part 2: Electroless Nickel-Gold Mehr erfahren »
The soldering surface – also known as the end surface or PCB finish – is a thin metallic or organic layer that the PCB manufacturer applies to the copper surfaces of the component connections (solder pads). As natural copper tends to oxidize in the air, soldering the components would be difficult or impossible. The soldering
Solder surface or printed circuit board finish, Part 1: Function and properties Mehr erfahren »
Design rules for high current conductor paths These rules must be observed when designing HSMtec printed circuit boards: Standard values for HSMtec PCBs are 0.8 to 3.2 mm final thickness; maximum 12 layers; maximum 3 layers for the copper cross-sections with copper profiles as well as currents up to 400 A Basic rule for current
Tips for PCB design with copper elements (HSMtec) – Part 2 Mehr erfahren »
When designing HSMtec-PCBs with integrated copper elements, it is generally recommended to design the high-current conductors before the standard layout. The development process of an HSMtec printed circuit board takes place in 10 design steps: Define mechanical features: Determine the size and contour of the printed circuit board Place power components: define short and simple
Tips for PCB design with copper elements (HSMtec) – Part 1 Mehr erfahren »
Interview with Margret Gleiniger (CEO/CFO) and Swen Klöden (CTO) of KSG GmbH and Kornel Schmidt, Managing Director of KSG Austria GmbH Made in Europe’ is anything but a matter of course when it comes to the manufacture of printed circuit boards. KSG GmbH manufactures a wide range of printed circuit boards for the international market
Printed circuit boards with flexibility (Business Forum, August 2021) Mehr erfahren »
Iceberg®: uniform surface level over the entire conductor pattern Iceberg® printed circuit boards are partial thick copper printed circuit boards. In a wiring layer there are areas with 50 to 70 µm copper for the control and areas with up to 400 µm copper for the load. The thick copper is largely recessed into the
Thick copper, Iceberg® and HSMtec® are three different technologies for high current PCBs. The article compares the three technologies and explains the design possibilities, current carrying capacity and heat dissipation of the power semiconductors. Engine control adjusts speed, power and torque to demand and operating conditions and plays a major role in the energy efficiency
