Today we are delving into the world of PCB marking and discovering its importance in the context of Industry 4.0 and Smart Factory. At a time when technology and production are merging seamlessly, labeling is not just simple information, but the input that paves the way for efficient, intelligent and sustainable production. ultra-modern production. Let’s […]
PCB marking shapes the future of smart production Mehr erfahren »
In a fast-paced world, trusting business collaborations are rare. So how do you build and maintain a strong customer-supplier relationship over 30 years? One example of this is the successful cooperation between GE HealthCare and us, the KSG Group. We have been producing production-ready printed circuit boards for various industries for over 64 years. Our
Sustainable mobility is one of the most important fields of development: Solar cars can travel long distances, without any breaks for charging. Students of the Belgian Agoria Solar Teams from Leuven managed to set records with a KSG circuit board. In the blog article, you will learn from team captain Mathieu Peeters how KSG was
Solar car from Agoria Solar: How a KSG circuit board helped set the world record Mehr erfahren »
From process optimization to digitalization: KSG provides insight into practice.
HSMtec 3D printed circuit board: the self-supporting 3D construction The HSMtec 3D printed circuit board does not require any flex foil at the bending point. This technique uses copper wires and copper profiles pressed into the FR4 material of the multilayer as bendable material. At the bending edges the FR4 is removed with notch milling.
3D printed circuit boards: three technologies, three examples (Part 3) Mehr erfahren »
Semiflex printed circuit board: the low-cost alternative to rigid-flex Semiflex is considered a cost-effective alternative to rigid-flex technology. The absence of flex foils lowers the price, but also reduces the bending properties. The moving areas are created here by deep milling in the FR4 circuit board, and the residual thickness is only approx. 150 µm.
3D printed circuit boards: three technologies, three examples (part 2) Mehr erfahren »
Three-dimensional printed circuit boards make optimum use of the limited installation space and can be constructed using various processes, assembly variants and materials. With rigid-flex, semiflex and HSMtec 3D, we present three manufacturing processes and highlight their technical properties, possible applications as well as their advantages and limitations. Increasing packing density, reducing weight
3D printed circuit boards: three technologies, three examples (part 1) Mehr erfahren »
