Category: Themes

Tips for PCB design with copper elements (HSMtec) – Part 2

Design rules for high current conductor paths These rules must be observed when designing HSMtec printed circuit boards: Standard values for HSMtec PCBs are 0.8 to 3.2 mm final thickness; maximum 12 layers; maximum 3 layers for the copper cross-sections with copper profiles as well as currents up to 400 A. Basic rule for current

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Tips for PCB design with copper elements (HSMtec) – Part 1

When designing HSMtec-PCBs with integrated copper elements, it is generally recommended to design the high-current conductors before the standard layout. The development process of an HSMtec printed circuit board takes place in 10 design steps: Define mechanical features: Determine the size and contour of the printed circuit board Place power components: define short and simple

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Printed circuit boards for high current densities and efficient thermal management (1)

Thick copper, Iceberg® and HSMtec® are three different technologies for high current PCBs. The article compares the three technologies and explains the design possibilities, current carrying capacity and heat dissipation of the power semiconductors. Engine control adjusts speed, power and torque to demand and operating conditions and plays a major role in the energy efficiency

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Iceberg® circuit boards

Iceberg® circuit boards are partial thick copper circuit boards with mixed copper thicknesses of 105 and 400 µm on the same level in the outer layers. In the process, about two thirds of the thick copper is sunk into the base material. The “sinking” of the thick copper structures in the base material enables a

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SIR test according to IPC

The SIR test (surface insulation resistance) is used to test the surface resistance in a humid/heat climate. In addition to temperature fluctuations, electronic assemblies are often subject to the effects of moisture during use. Moisture can lead to the accelerated formation of migration paths that eventually cause a short circuit. These are usually recognizable by

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3D printed circuit boards: three technologies, three examples (Part 3)

HSMtec 3D printed circuit board: the self-supporting 3D construction The HSMtec 3D printed circuit board does not require any flex foil at the bending point. This technique uses copper wires and copper profiles pressed into the FR4 material of the multilayer as bendable material. At the bending edges the FR4 is removed with notch milling.

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3D printed circuit boards: three technologies, three examples (Part 2)

Semiflex PCB: the low-cost alternative to rigidflex Semiflex is considered a low-cost alternative to rigid-flex technology. The absence of flex foils lowers the price, but also reduces the bending properties. The movable areas here are created by deep milling in the FR4 PCB, the remaining thickness is only about 150 µm. The PCB is therefore

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3D printed circuit boards: three technologies, three examples (Part 1)

Three-dimensional PCBs make optimum use of limited installation space and can be constructed using various processes, assembly variants and materials. With rigid-flex, semiflex and HSMtec 3D, we present three manufacturing processes and shed light on their technical properties, possible applications as well as their advantages and limitations. Increasing packing density, reducing weight and at the

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