Category: Technology

HSMtec cross section
English

Tips for PCB design with copper elements (HSMtec) – Part 2

Design rules for high current conductor paths These rules must be observed when designing HSMtec printed circuit boards: Standard values for HSMtec PCBs are 0.8 to 3.2 mm final thickness; maximum 12 layers; maximum 3 layers for the copper cross-sections with copper profiles as well

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HSMtec cross section
English

Tips for PCB design with copper elements (HSMtec) – Part 1

When designing HSMtec-PCBs with integrated copper elements, it is generally recommended to design the high-current conductors before the standard layout. The development process of an HSMtec printed circuit board takes place in 10 design steps: Define mechanical features: Determine the size and contour of the

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English

Iceberg® circuit boards

Iceberg® printed circuit boards are partial thick copper printed circuit boards with mixed copper thicknesses of 105 and 400 µm on the same plane in the outer layers. In the process, about two thirds of the thick copper is sunk into the base material. The

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pcb

Storing printed circuit boards correctly: the most important tips

Incorrect handling and improper storage of printed circuit boards have fatal consequences. Contamination, moisture and electrostatic charge can irreparably damage printed circuit boards or later electronic assemblies, reduce solderability and affect the electrical test. Absorbed moisture in base materials can cause internal delamination, twisting and

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HSMtec 3D printed circuit board
Applications

3D printed circuit boards: three technologies, three examples (part 1)

Three-dimensional printed circuit boards make optimum use of the limited installation space and can be constructed using various processes, assembly variants and materials. With rigid-flex, semiflex and HSMtec 3D, we present three manufacturing processes and highlight their technical properties, possible applications as well as

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