Design rules for high current conductor paths These rules must be observed when designing HSMtec printed circuit boards: Standard values for HSMtec PCBs are 0.8 to 3.2 mm final thickness; maximum 12 layers; maximum 3 layers for the copper cross-sections with copper profiles as well
When designing HSMtec-PCBs with integrated copper elements, it is generally recommended to design the high-current conductors before the standard layout. The development process of an HSMtec printed circuit board takes place in 10 design steps: Define mechanical features: Determine the size and contour of the
Iceberg®: uniform surface level over the entire conductor pattern Iceberg® printed circuit boards are partial thick copper printed circuit boards. In a wiring layer there are areas with 50 to 70 µm copper for the control and areas with up to 400 µm copper for
Thick copper, Iceberg® and HSMtec® are three different technologies for high current PCBs. The article compares the three technologies and explains the design possibilities, current carrying capacity and heat dissipation of the power semiconductors. Engine control adjusts speed, power and torque to demand and operating
Iceberg® printed circuit boards are partial thick copper printed circuit boards with mixed copper thicknesses of 105 and 400 µm on the same plane in the outer layers. In the process, about two thirds of the thick copper is sunk into the base material. The
Incorrect handling and improper storage of printed circuit boards have fatal consequences. Contamination, moisture and electrostatic charge can irreparably damage printed circuit boards or later electronic assemblies, reduce solderability and affect the electrical test. Absorbed moisture in base materials can cause internal delamination, twisting and
HSMtec 3D printed circuit board: the self-supporting 3D construction The HSMtec 3D printed circuit board does not require any flex foil at the bending point. This technique uses copper wires and copper profiles pressed into the FR4 material of the multilayer as bendable material. At
Semiflex printed circuit board: the low-cost alternative to rigid-flex Semiflex is considered a cost-effective alternative to rigid-flex technology. The absence of flex foils lowers the price, but also reduces the bending properties. The moving areas are created here by deep milling in the FR4 circuit
Three-dimensional printed circuit boards make optimum use of the limited installation space and can be constructed using various processes, assembly variants and materials. With rigid-flex, semiflex and HSMtec 3D, we present three manufacturing processes and highlight their technical properties, possible applications as well as