Iceberg®: uniform surface level over the entire conductor pattern
Iceberg® printed circuit boards are partial thick copper printed circuit boards. In a wiring layer there are areas with 50 to 70 µm copper for the control and areas with up to 400 µm copper for the load. The thick copper is largely recessed into the circuit board. This creates a uniform surface topography over the entire conductor pattern, which simplifies the assembly of the printed circuit board.
The “sinking” of two thirds of the copper thickness in the base material allows a minimum copper thickness of the entire conductor pattern outside the base material. Advantage: The conductor flanks can be covered with solder resist in just one casting process.
Iceberg® structures are also suitable as heat sinks for power components and can be combined with plated-through holes (vias) to optimize thermal management.
HSMtec® uses solid copper elements in the inner layers
With HSMtec®, solid copper elements are selectively laid in the inner layers and under outer layers of the FR4 multilayer and bonded with ultrasound to the base copper of the etched conductor patterns. After pressing the layers, the copper profiles are located under the outer layers and/or in the inner layers of the multilayer. The rest of the circuit board remains unaffected. The multilayer is manufactured in the standard production process and further processed in the usual assembly and soldering process.
The solid copper profiles inside the multilayer also allow three-dimensional constructions. Due to notch milling perpendicular to the copper profiles, segments of the PCB can be bent up to 90°. In this way, installation space is cleverly utilized and high current and heat are transported via the bending edge. The design is laid out as a two-dimensional printed circuit board, manufactured in the panel and assembled. After the assembly or for the assembly of the module, the printed circuit board is bent into the three-dimensional form.
The table compares the possibilities of the three methods:
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