Tag: HSMtec

Tips for PCB design with copper elements (HSMtec) – Part 2

Design rules for high current conductor paths These rules must be observed when designing HSMtec printed circuit boards: Standard values for HSMtec PCBs are 0.8 to 3.2 mm final thickness; maximum 12 layers; maximum 3 layers for the copper cross-sections with copper profiles as well as currents up to 400 A. Basic rule for current

Weiterlesen »

Tips for PCB design with copper elements (HSMtec) – Part 1

When designing HSMtec-PCBs with integrated copper elements, it is generally recommended to design the high-current conductors before the standard layout. The development process of an HSMtec printed circuit board takes place in 10 design steps: Define mechanical features: Determine the size and contour of the printed circuit board Place power components: define short and simple

Weiterlesen »

Printed circuit boards for high current densities and efficient thermal management (1)

Thick copper, Iceberg® and HSMtec® are three different technologies for high current PCBs. The article compares the three technologies and explains the design possibilities, current carrying capacity and heat dissipation of the power semiconductors. Engine control adjusts speed, power and torque to demand and operating conditions and plays a major role in the energy efficiency

Weiterlesen »


In the HSMtec® process, 500 µm thick copper elements with variable widths from 2 to 12 mm and individual lengths are laid in the inner layers of the multilayer and embedded in the PCB. Through the partial integration of copper profiles into the PCB, high-current paths – or heat management and fine conductor layout –

Weiterlesen »
Scroll to Top