Day: June 2, 2021

3D printed circuit boards: three technologies, three examples (Part 3)

HSMtec 3D printed circuit board: the self-supporting 3D construction The HSMtec 3D printed circuit board does not require any flex foil at the bending point. This technique uses copper wires and copper profiles pressed into the FR4 material of the multilayer as bendable material. At the bending edges the FR4 is removed with notch milling.

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