HSMtec 3D printed circuit board: the self-supporting 3D construction The HSMtec 3D printed circuit board does not require any flex foil at the bending point. This technique uses copper wires and copper profiles pressed into the FR4 material of the multilayer as bendable material. At the bending edges the FR4 is removed with notch milling.
Semiflex PCB: the low-cost alternative to rigidflex Semiflex is considered a low-cost alternative to rigid-flex technology. The absence of flex foils lowers the price, but also reduces the bending properties. The movable areas here are created by deep milling in the FR4 PCB, the remaining thickness is only about 150 µm. The PCB is therefore
Three-dimensional PCBs make optimum use of limited installation space and can be constructed using various processes, assembly variants and materials. With rigid-flex, semiflex and HSMtec 3D, we present three manufacturing processes and shed light on their technical properties, possible applications as well as their advantages and limitations. Increasing packing density, reducing weight and at the