Category: Technology

HSMtec cross section
Technology

Tips for PCB design with copper elements (HSMtec) – Part 2

Design rules for high current conductor paths These rules must be observed when designing HSMtec printed circuit boards: Standard values for HSMtec PCBs are 0.8 to 3.2 mm final thickness; maximum 12 layers; maximum 3 layers for the copper cross-sections with copper profiles as well

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HSMtec cross section
Technology

Tips for PCB design with copper elements (HSMtec) – Part 1

When designing HSMtec-PCBs with integrated copper elements, it is generally recommended to design the high-current conductors before the standard layout. The development process of an HSMtec printed circuit board takes place in 10 design steps: Define mechanical features: Determine the size and contour of the

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Technical terms

Iceberg® circuit boards

Iceberg® circuit boards are partial thick copper circuit boards with mixed copper thicknesses of 105 and 400 µm on the same level in the outer layers. In the process, about two thirds of the thick copper is sunk into the base material. The “sinking” of

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HSMtec 3D pcb
Applications

3D printed circuit boards: three technologies, three examples (Part 1)

Three-dimensional PCBs make optimum use of limited installation space and can be constructed using various processes, assembly variants and materials. With rigid-flex, semiflex and HSMtec 3D, we present three manufacturing processes and shed light on their technical properties, possible applications as well as their advantages

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Roadmap
Recent Posts

A look at the roadmap for the European printed circuit board industry

Multifunctional system boards are already state of the art today. Different starting materials, methods and manufacturing processes enable highly specialised circuit carriers: densely packed and/or highly integrated, RF-capable, high-current-capable, heat-optimised and three-dimensional. The current technology roadmap shows what drives and controls the development of PCB

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