The abbreviation HDI stands for High Density Interconnect and refers to multilayer printed circuit boards with four or more layers that are built up sequentially in several pressing operations (Sequential Build Up, abbreviated: SBU). With this design, high wiring and placement densities for high-pole active components can be realized on an electronic assembly.
This year, the printed circuit board manufacturer KSG has invested around 11.6 million euros in its two plants in Gornsdorf and Gars am Kamp. In addition to expanding production capacity, KSG is also expanding its process technology for high-speed RF and HDI/SBU printed circuit boards. “With this year’s investments, we are expanding our expertise in
Multifunctional system boards are already state of the art today. Different starting materials, methods and manufacturing processes enable highly specialized circuit carriers: densely packed and/or highly integrated, RF-capable, high-current-capable, heat-optimized and three-dimensional. The current technology roadmap shows what drives and controls the development of PCB technology and where the journey is headed. The development of