HDI/SBU circuit boards

The abbreviation HDI stands for High Density Interconnect and refers to multilayer PCBs with four or more layers that are built up sequentially in several press cycles (Sequential Build Up, abbreviated: SBU). With this structure, high wiring and assembly densities for high-pole active components can be realised on an electronic assembly. Typical for an HDI

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A look at the roadmap for the European printed circuit board industry

Multifunctional system boards are already state of the art today. Different starting materials, methods and manufacturing processes enable highly specialised circuit carriers: densely packed and/or highly integrated, RF-capable, high-current-capable, heat-optimised and three-dimensional. The current technology roadmap shows what drives and controls the development of PCB technology and where the journey is heading. The development of

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