KSG has received UL listing for the production of unpopulated printed circuit boards with the high-frequency material Megtron 6 after successfully passing UL testing of the sample sets.
From now on we are authorized to apply the identifier “M6” for multilayer boards with Megtron 6 material (and analogously “S6” for double-sided boards).
As one of the first PCB manufacturers in Europe, we qualified the new Multiple Solder Limits required by UL in this project. In contrast to the common thermostatic stress test according to TM 650 2.6.8, the samples were subjected to a reflow simulation according to TM 650 2.6.27A (6 reflow cycles with maximum temperature 260°C).
KSG was an active member of the FED/ZVEI Roundtable that developed the Multiple Solder Limits proposal. The proposal has not yet been fully incorporated into the new UL Standard UL796 and UL94; UL has announced that this will happen in December 2021.
Megtron 6 is a material from the manufacturer Panasonic, which is characterized by a low electricity constant and very low dissipation factor. In addition, it is very temperature resistant.
The material has been used worldwide for high-frequency applications with high signal transmission rates for years. The material is mainly used in information and communication infrastructure equipment, such as that needed for 5G. Such applications can be, for example, high-end servers, routers, switches or wireless base stations.