KSG brings plugging process in-house

PCB manufacturer KSG has implemented the plugging process for filling through and blind holes in its production. The higher integration densities possible with plugging lead to a considerable space gain in SBU setups (SBU: sequential build up) and thus to fewer restrictions in the layout design of complex circuits (technology “via in pad” or “staggered/stacked microvia on buried via”).

KSG has opted for full-surface, vertical vacuum filling due to the wide range of applications. In addition to through-holes, this process also allows blind holes drilled mechanically or by laser to be filled quickly, reliably with consistent reproduciblity making it suitable for a wide range of applications. Further advantages compared to the conventional screen printing process are the air bubble-free filling of the boreholes, a high degree of flexibility, lower paste consumption and the filling of boreholes with more demanding borehole depths.

With the in-house process, we are expanding our capacity in addition to the external service option that continues to exist. In this way, we increase our flexibility, entirely in the interest of our customers,” explains Christof Sofsky, Sales Manager at KSG.


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