This year, the PCB manufacturer KSG has invested around 11.6 million euros in its two plants in Gornsdorf and Gars am Kamp. In addition to expanding its production capacities, KSG is also expanding its process technology for high-speed HF and HDI/SBU PCBs.
“With this year’s investments, we are increasing our competence in HDI/SBU (high density interconnection/sequential built up) PCBs and continuing on our course for security of supply, high product quality and flexibility,” says Swen Klöden, CTO. We have invested around 10.8 million euros in the Gornsdorf plant in Saxony and further expanded production capacities at the Gars am Kamp plant in Lower Austria with around 800,000 euros.
With extensive, demand-oriented investments totalling 35.3 million euros, KSG has already converted the two sites into high-end manufacturing facilities and expanded production capacities at the Gars plant over the past three years. This year, the largest investment projects are focused on expanding technological capabilities as well as capacity expansion and increasing process reliability in key processes. These include the installation of the plugging process for filling boreholes and blind holes, another laser drilling machine and the installation of a measuring machine for conductor tension measurement of highly complex antenna structures.
Security of supply and technology expansion for HDI/SBU multilayers
Our process experts in Gornsdorf have also planned an SES plant (stripping/etching/stripping), a copper recycling plant and an electroplating plant, which will be installed in 2021. This brings security of supply paired with technology expansion for the process-reliable production of highly complex HDI/SBU superstructures. The higher integration densities possible with this process offer PCB designers considerable space savings and fewer restrictions in the layout of complex circuits.
“Semiconductors continue to push the development of PCB technology. For us, this means we have to continue to perfect the properties of the PCBs with ever smaller dimensions,” Klöden emphasises. Today, twelve-layer HDI multilayers with a line/space of 100 µm and smaller are state of the art in Europe.
Optimised signal integrity requires an even higher integration density. For this, PCB designers are forced to combine impedance-controlled multilayers with layer structures larger than twelve layers with complex SBU structures 3+x+3 and fine-pitch patterns smaller than 75/75 µm line/space. When unbundling fine-pitch BGA structures with several hundred connections on the bottom side, the rewiring strategies with plugging, staggered or stacked microvia arrangements are becoming increasingly important.