This year, the printed circuit board manufacturer KSG has invested around 11.6 million euros in its two plants in Gornsdorf and Gars am Kamp. In addition to expanding production capacity, KSG is also expanding its process technology for high-speed RF and HDI/SBU printed circuit boards.
“With this year’s investments, we are expanding our expertise in HDI/SBU (High Density Interconnection/Sequential Built Up) printed circuit boards and continuing on our course for security of supply, high product quality and flexibility,” says Swen Klöden, CTO. We invested around 10.8 million euros in the Gornsdorf plant in Saxony and further expanded production capacity at the Gars am Kamp plant in Lower Austria with around 800,000 euros.
With extensive, demand-oriented investments totaling 35.3 million euros, KSG has already converted the two sites into high-end manufacturing facilities over the past three years and expanded production capacity at the Gars plant. This year, the largest investment projects are focused on expanding technological capabilities as well as increasing capacity and process reliability in key processes. This includes the installation of the plugging process for filling boreholes and blind holes, another laser drilling machine, and the installation of a measuring machine for conductor voltage measurement of highly complex antenna structures.
Security of supply and technology expansion for HDI/SBU multilayers
Our process experts in Gornsdorf have also planned an SES (stripping/etching/stripping) plant, a copper recycling plant, and an electroplating plant to be installed in 2021. This brings security of supply coupled with technology enhancement for the process-reliable production of highly complex HDI/SBU superstructures. The higher integration densities possible with this process offer PCB designers significant space savings and fewer constraints when laying out complex circuits.
“Semiconductors continue to drive the development of PCB technology. For us, this means that we have to continue to perfect the properties of the printed circuit boards with ever smaller dimensions,” emphasizes Klöden. Twelve-layer HDI multilayers with a line/gap of 100 µm and smaller are state of the art in Europe today.
Optimized signal integrity requires even higher integration density. To achieve this, PCB designers are forced to combine impedance-controlled multilayers with layer structures larger than twelve layers with complex SBU structures 3+x+3 and fine-pitch patterns smaller than 75/75 µm line/space. When unbundling fine-pitch BGA structures with several hundred connections on the bottom side, rewiring strategies with pluggable, staggered or stacked microvia arrangements are becoming increasingly important.