KSG editorial office, Autor bei pcb-blog.com

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The HAL lead-free solder surface offers the best solderability of all surfaces, but the thickness of the tin layer varies.

For the Soldering surface immersion tin (chem. Sn) or ISn (immersion Tin), a 1 to 1.3 µm thin tin layer

The solder surface electroless nickel-gold (chem. NiAu) is also called ENIG (Electroless Nickel Immersion Gold). In a wet chemical process,

The solder surface, final surface or also called PCB finish, is a thin metallic or organic layer that the PCB

The next generation of technicians is very important to us. We want to get children and young people excited about

In the HSMtec process, 500 µm thick copper elements with variable widths from 2 to 12 mm and individual

pcb-blog is the name of the new corporate blog of PCB specialist KSG, which has been online since April. Here,