The HAL lead-free solder surface offers the best solderability of all surfaces, but the thickness of the tin layer varies.
Author: KSG editorial office
For the Soldering surface immersion tin (chem. Sn) or ISn (immersion Tin), a 1 to 1.3 µm thin tin layer
The solder surface electroless nickel-gold (chem. NiAu) is also called ENIG (Electroless Nickel Immersion Gold). In a wet chemical process,
The solder surface, final surface or also called PCB finish, is a thin metallic or organic layer that the PCB