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Katharina Luchner

Basic material (Photo: KSG)

Qualification incl. UL listing Panasonic Megtron 6 successfully completed

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KSG has received UL listing for the production of unpopulated printed circuit boards with the high-frequency material Megtron 6 after successfully passing UL testing of the sample sets. From now on we are authorized to apply the identifier “M6” for multilayer boards with Megtron 6 material (and analogously “S6” for double-sided boards). As one of […]

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Person hält Leiterplatten

Storing printed circuit boards correctly: the most important tips

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Incorrect handling and improper storage of printed circuit boards have fatal consequences. Contamination, moisture and electrostatic charge can irreparably damage printed circuit boards or later electronic assemblies, reduce solderability and affect the electrical test. Absorbed moisture in base materials can cause internal delamination, twisting and warping, or excessive stresses in the through-metallizations. The reason: During

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HSMtec 3D printed circuit board

3D printed circuit boards: three technologies, three examples (Part 3)

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HSMtec 3D printed circuit board: the self-supporting 3D construction The HSMtec 3D printed circuit board does not require any flex foil at the bending point. This technique uses copper wires and copper profiles pressed into the FR4 material of the multilayer as bendable material. At the bending edges the FR4 is removed with notch milling.

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The semi-flexible PCB design is bent twice at 90° and carries 195 electrical connections across the two semi-flexible areas.

3D printed circuit boards: three technologies, three examples (part 2)

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Semiflex printed circuit board: the low-cost alternative to rigid-flex Semiflex is considered a cost-effective alternative to rigid-flex technology. The absence of flex foils lowers the price, but also reduces the bending properties. The moving areas are created here by deep milling in the FR4 circuit board, and the residual thickness is only approx. 150 µm.

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HSMtec 3D printed circuit board

3D printed circuit boards: three technologies, three examples (part 1)

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Three-dimensional printed circuit boards make optimum use of the limited installation space and can be constructed using various processes, assembly variants and materials. With rigid-flex, semiflex and HSMtec 3D, we present three manufacturing processes and highlight their technical properties, possible applications as well as their advantages and limitations. Increasing packing density, reducing weight

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HDI-SBU multilayer

HDI/SBU printed circuit boards

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The abbreviation HDI stands for High Density Interconnect and refers to multilayer printed circuit boards with four or more layers that are built up sequentially in several pressing operations (Sequential Build Up, abbreviated: SBU). With this design, high wiring and placement densities for high-pole active components can be realized on an electronic assembly.

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KSG Printed circuit board production

KSG expands production capacity for multilayer and HDI/SBU printed circuit boards

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This year, the printed circuit board manufacturer KSG has invested around 11.6 million euros in its two plants in Gornsdorf and Gars am Kamp. In addition to expanding production capacity, KSG is also expanding its process technology for high-speed RF and HDI/SBU printed circuit boards. “With this year’s investments, we are expanding our expertise in

KSG expands production capacity for multilayer and HDI/SBU printed circuit boards Mehr erfahren »

Road map

A look at the roadmap for the European printed circuit board industry

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Multifunctional system boards are already state of the art today. Different starting materials, methods and manufacturing processes enable highly specialized circuit carriers: densely packed and/or highly integrated, RF-capable, high-current-capable, heat-optimized and three-dimensional. The current technology roadmap shows what drives and controls the development of PCB technology and where the journey is headed. The development of

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KSG starts plugging process in-house

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PCB manufacturer KSG has introduced the plugging process for filling through and blind holes in its production. The higher integration densities possible with plugging lead to considerable space savings in SBU setups (SBU: sequential setup) and thus to fewer restrictions in the layout design of complex circuits (technology “via in pad” or “staggered/stacked microvia

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