The printed circuit board manufacturer KSG has mastered the past 18 months with entrepreneurial skill and customer service. The business situation is pleasing and the team has grown to meet the challenges. “We learned three things in the Corona crisis,” says CEO Margret Gleiniger. “Firstly, that we can change ad hoc and that changes are […]
The stress test showed how agile and mobile our company is Mehr erfahren »
ENAL = Use of nano-coated tools in printed circuit board production Approximately ten percent of the manufacturing costs of a printed circuit board are caused by the mechanical manufacturing processes, drilling and milling. The costs for drilling and milling tools play a not insignificant role. Together with KSG, a Saxon project consortium within the framework
Short portrait of the ENAL funding project Mehr erfahren »
Design rules for high current conductor paths These rules must be observed when designing HSMtec printed circuit boards: Standard values for HSMtec PCBs are 0.8 to 3.2 mm final thickness; maximum 12 layers; maximum 3 layers for the copper cross-sections with copper profiles as well as currents up to 400 A Basic rule for current
Tips for PCB design with copper elements (HSMtec) – Part 2 Mehr erfahren »
When designing HSMtec-PCBs with integrated copper elements, it is generally recommended to design the high-current conductors before the standard layout. The development process of an HSMtec printed circuit board takes place in 10 design steps: Define mechanical features: Determine the size and contour of the printed circuit board Place power components: define short and simple
Tips for PCB design with copper elements (HSMtec) – Part 1 Mehr erfahren »
Interview with Margret Gleiniger (CEO/CFO) and Swen Klöden (CTO) of KSG GmbH and Kornel Schmidt, Managing Director of KSG Austria GmbH Made in Europe’ is anything but a matter of course when it comes to the manufacture of printed circuit boards. KSG GmbH manufactures a wide range of printed circuit boards for the international market
Printed circuit boards with flexibility (Business Forum, August 2021) Mehr erfahren »
Iceberg®: uniform surface level over the entire conductor pattern Iceberg® printed circuit boards are partial thick copper printed circuit boards. In a wiring layer there are areas with 50 to 70 µm copper for the control and areas with up to 400 µm copper for the load. The thick copper is largely recessed into the
Thick copper, Iceberg® and HSMtec® are three different technologies for high current PCBs. The article compares the three technologies and explains the design possibilities, current carrying capacity and heat dissipation of the power semiconductors. Engine control adjusts speed, power and torque to demand and operating conditions and plays a major role in the energy efficiency
Iceberg® printed circuit boards are partial thick copper printed circuit boards with mixed copper thicknesses of 105 and 400 µm on the same plane in the outer layers. In the process, about two thirds of the thick copper is sunk into the base material. The “sinking” of the thick copper structures in the base material
Iceberg® circuit boards Mehr erfahren »
Plugging, Holefilling, Microvia Copper Filling or Via Hole Plugging refers to the filling of metallized through holes or metallized blind holes on the outer layers of the printed circuit board. There, even with highly complex circuit carriers, a planar surface topography is achieved, through which the process reliability and dependability in the assembly process, no
