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Month: August 2021

Short portrait of the ENAL funding project

ENAL = Use of nano-coated tools in printed circuit board production Approximately ten percent of the manufacturing costs of a printed circuit board are caused by the mechanical manufacturing processes, drilling and milling. The costs for drilling and milling tools play a not insignificant role. Together with KSG, a Saxon project consortium within the framework

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Tips for PCB design with copper elements (HSMtec) – Part 2

Design rules for high current conductor paths These rules must be observed when designing HSMtec printed circuit boards: Standard values for HSMtec PCBs are 0.8 to 3.2 mm final thickness; maximum 12 layers; maximum 3 layers for the copper cross-sections with copper profiles as well as currents up to 400 A Basic rule for current

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Tips for PCB design with copper elements (HSMtec) – Part 1

When designing HSMtec-PCBs with integrated copper elements, it is generally recommended to design the high-current conductors before the standard layout. The development process of an HSMtec printed circuit board takes place in 10 design steps: Define mechanical features: Determine the size and contour of the printed circuit board Place power components: define short and simple

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Printed circuit boards with flexibility (Business Forum, August 2021)

Interview with Margret Gleiniger (CEO/CFO) and Swen Klöden (CTO) of KSG GmbH and Kornel Schmidt, Managing Director of KSG Austria GmbH Made in Europe’ is anything but a matter of course when it comes to the manufacture of printed circuit boards. KSG GmbH manufactures a wide range of printed circuit boards for the international market

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