Month: July 2021

Printed circuit boards for high current densities and efficient thermal management (1)

Thick copper, Iceberg® and HSMtec® are three different technologies for high current PCBs. The article compares the three technologies and explains the design possibilities, current carrying capacity and heat dissipation of the power semiconductors. Engine control adjusts speed, power and torque to demand and operating conditions and plays a major role in the energy efficiency

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Iceberg® circuit boards

Iceberg® circuit boards are partial thick copper circuit boards with mixed copper thicknesses of 105 and 400 µm on the same level in the outer layers. In the process, about two thirds of the thick copper is sunk into the base material. The “sinking” of the thick copper structures in the base material enables a

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KSG supports talent competition Paul-Award

The next generation of technicians is very important to us. We want to get children and young people excited about electronics development and careers in the electronics industry. That is why KSG also supports the continuation of the Paul Award talent competition after the first round. In this competition, young people realise their own project

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