Plugging, Holefilling, Microvia Copper Filling or Via Hole Plugging refers to the filling of metallized through holes or metallized blind holes on the outer layers of the printed circuit board. There, even with highly complex circuit carriers, a planar surface topography is achieved, through which the process reliability and dependability in the assembly process, no
KSG has received UL listing for the production of unpopulated printed circuit boards with the high-frequency material Megtron 6 after successfully passing UL testing of the sample sets. From now on we are authorized to apply the identifier “M6” for multilayer boards with Megtron 6 material (and analogously “S6” for double-sided boards). As one of
Incorrect handling and improper storage of printed circuit boards have fatal consequences. Contamination, moisture and electrostatic charge can irreparably damage printed circuit boards or later electronic assemblies, reduce solderability and affect the electrical test. Absorbed moisture in base materials can cause internal delamination, twisting and warping, or excessive stresses in the through-metallizations. The reason: During
HSMtec 3D printed circuit board: the self-supporting 3D construction The HSMtec 3D printed circuit board does not require any flex foil at the bending point. This technique uses copper wires and copper profiles pressed into the FR4 material of the multilayer as bendable material. At the bending edges the FR4 is removed with notch milling.