Semiflex printed circuit board: the low-cost alternative to rigid-flex Semiflex is considered a cost-effective alternative to rigid-flex technology. The absence of flex foils lowers the price, but also reduces the bending properties. The moving areas are created here by deep milling in the FR4 circuit board, and the residual thickness is only approx. 150 µm.
Three-dimensional printed circuit boards make optimum use of the limited installation space and can be constructed using various processes, assembly variants and materials. With rigid-flex, semiflex and HSMtec 3D, we present three manufacturing processes and highlight their technical properties, possible applications as well as their advantages and limitations. Increasing packing density, reducing weight
In the HSMtec process, 500 µm thick copper elements with variable widths from 2 to 12 mm and individual lengths are placed in the inner layers of the multilayer and embedded in the printed circuit board. By partially integrating copper profiles into the PCB, high-current paths – or thermal management and fine conductor layout
The abbreviation HDI stands for High Density Interconnect and refers to multilayer printed circuit boards with four or more layers that are built up sequentially in several pressing operations (Sequential Build Up, abbreviated: SBU). With this design, high wiring and placement densities for high-pole active components can be realized on an electronic assembly.