Month: May 2021

3D printed circuit boards: three technologies, three examples (Part 2)

Semiflex PCB: the low-cost alternative to rigidflex Semiflex is considered a low-cost alternative to rigid-flex technology. The absence of flex foils lowers the price, but also reduces the bending properties. The movable areas here are created by deep milling in the FR4 PCB, the remaining thickness is only about 150 µm. The PCB is therefore

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3D printed circuit boards: three technologies, three examples (Part 1)

Three-dimensional PCBs make optimum use of limited installation space and can be constructed using various processes, assembly variants and materials. With rigid-flex, semiflex and HSMtec 3D, we present three manufacturing processes and shed light on their technical properties, possible applications as well as their advantages and limitations. Increasing packing density, reducing weight and at the

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In the HSMtec® process, 500 µm thick copper elements with variable widths from 2 to 12 mm and individual lengths are laid in the inner layers of the multilayer and embedded in the PCB. Through the partial integration of copper profiles into the PCB, high-current paths – or heat management and fine conductor layout –

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HDI/SBU circuit boards

The abbreviation HDI stands for High Density Interconnect and refers to multilayer PCBs with four or more layers that are built up sequentially in several press cycles (Sequential Build Up, abbreviated: SBU). With this structure, high wiring and assembly densities for high-pole active components can be realised on an electronic assembly. Typical for an HDI

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