Month: April 2021

A look at the roadmap for the European printed circuit board industry

Multifunctional system boards are already state of the art today. Different starting materials, methods and manufacturing processes enable highly specialised circuit carriers: densely packed and/or highly integrated, RF-capable, high-current-capable, heat-optimised and three-dimensional. The current technology roadmap shows what drives and controls the development of PCB technology and where the journey is heading. The development of

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KSG brings plugging process in-house

PCB manufacturer KSG has implemented the plugging process for filling through and blind holes in its production. The higher integration densities possible with plugging lead to a considerable space gain in SBU setups (SBU: sequential build up) and thus to fewer restrictions in the layout design of complex circuits (technology “via in pad” or “staggered/stacked

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KSG launches pcb-blog

pcb-blog is the name of the new company blog of PCB specialist KSG, which has been online since April. Here, everything revolves around the printed circuit board: From application examples and tips for designers to webinars and technical terms to news from the company and the industry, the blog shares valuable expertise. The blog is

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