Month: April 2021

A look at the roadmap for the European printed circuit board industry

Multifunctional system boards are already state of the art today. Different starting materials, methods and manufacturing processes enable highly specialized circuit carriers: densely packed and/or highly integrated, RF-capable, high-current-capable, heat-optimized and three-dimensional. The current technology roadmap shows what drives and controls the development of PCB technology and where the journey is headed. The development of

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KSG starts plugging process in-house

PCB manufacturer KSG has introduced the plugging process for filling through and blind holes in its production. The higher integration densities possible with plugging lead to considerable space savings in SBU setups (SBU: sequential setup) and thus to fewer restrictions in the layout design of complex circuits (technology “via in pad” or “staggered/stacked microvia

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KSG launches pcb-blog

pcb-blog is the name of the new corporate blog of PCB specialist KSG, which has been online since April. Here, everything revolves around the printed circuit board: From application examples and tips for designers to webinars and technical terms to news from the company and the industry, the blog provides valuable know-how. The blog is

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